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DNES | LC898124EP1XC : Optical Image Stabilization (OIS) & Open-Auto Focus (AF) Controller & DriverIntegrated 32-bit DSP empowers flexible high performance OIS algorithmIntegrated EEPROM stores calibration dataSlim and small package supports small camera module designs Číst dál...
11. ledna 2017 | Electronica - MUNICH, Germany – Nov. 7, 2016 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced a modular IoT Development Kit (IDK) that provides engineers with all of the hardware and software building blocks needed to speed the evaluation, design and implementation of medical, home, and industrial IoT applications. ON Semiconductor offers a market-leading portfolio of power-efficient semiconductors for smart and connected IoT designs that includes sensors, power management, connectivity, processors and actuators. By combining these silicon solutions with a comprehensive software framework, the IDK offers a modular, easy to use and compact platform that provides developers with access to everything they need to rapidly develop cloud-based IoT designs. The ON Semiconductor IDK incorporates a variety of module options for sensing, wired and wireless connectivity and actuation. Its comprehensive software development framework encompasses an embedded operating system (ARM® mbed™ OS), drivers, APIs for hardware shields, a graphical user interface (GUI), and sample applications code. Built-in support for cloud software enables the platform to deliver data into the cloud for value added services such as analytics. The extensible modular architecture includes a variety of industry-standard interfaces such as Arduino and Pmod™, allowing the seamless integration of existing and future modules from both ON Semiconductor and third parties. “ON Semiconductor offers a one stop shop of leadership semiconductor elements for industrial, medical and home IoT applications. By providing a single, modular, extensible platform that combines hardware, software and support for integrating third parties, the new IDK allows engineers to quickly and easily harness the power of ON Semiconductor solutions and significantly simplify the prototyping of cloud-based applications,” said Wiren Perera, IoT Strategist for ON Semiconductor. The IDK is capable of supporting numerous application areas, including industrial automation, intelligent lighting, building automation, smart cities and a wide range of medical monitoring solutions. The ON Semiconductor booth at Electronica 2016 will feature demonstrations built using the IDK including wireless and PoE based smart lighting, heart rate monitoring, energy harvesting wireless sensor based fault prevention and an automated window shutter. As well as the IDK-based demos, visitors to the ON Semiconductor Electronica booth will have the opportunity to see other examples of IoT designs such as a PIR-based motion alarm featuring Sigfox cloud connectivity, an intelligent water meter and a smart power application. The IoT Development Kit will be available through our distribution partners. Contact your local ON Semiconductor sales representative for more information. Číst dál...
11. ledna 2017 | Electronica - MUNICH, Germany – Nov. 7, 2016 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, and a top 10 global automotive semiconductor supplier following its recent acquisition of Fairchild Semiconductor, has introduced the industry’s most compact 650 volt (V), 50 ampere (A) automotive qualified intelligent power module for controlling vehicle air conditioning (A/C) compressors. The FAM65V05DF1 addresses numerous other high voltage auxiliary motor applications in hybrid and electric vehicles and helps designers increase the performance and efficiency of applications while simultaneously reducing costs. The FAM65V05DF1 uniquely integrates IGBTs, freewheeling diodes and gate drivers in an automotive-qualified 12 cm2 footprint package which is up to 40% smaller than solutions assembled from multiple discrete components. The device greatly simplifies and shortens the process of designing the power stages of high voltage automotive auxiliary inverters for A/C compressors and oil pumps - applications that must comply with stringent performance standards in demanding operating environments and with tight space constraints. ON Semiconductor’s broad portfolio of automotive related products and technologies continues to address the latest applications throughout the vehicle, as areas such as automatic driver assistance systems (ADAS), LED lighting, motor control, vehicle connectivity and vehicle electrification evolve at a rapid pace. In addition, the company’s products are important in helping enable progress towards semi and fully autonomous vehicles in the future. The acquisition of Fairchild Semiconductor adds high voltage, plus a significantly broadened range of medium voltage devices, to a portfolio that already comprises industry-leading low and medium power solutions for traditional combustion engine vehicles as well as hybrid and full electric cars. Underlining ON Semiconductor’s strength and expertise in addressing the high-performance, challenging operating environments and quality requirements of the automotive industry is the landmark figure of one billion automotive ignition IGBTs sold to automakers worldwide being recently surpassed. The company maintains TS16949 certification, ISO26262 compliance, and has a zero defect program leveraging its advanced design techniques and testing methodologies. At Electronica 2016, the company’s 400 square metre booth will feature the latest products and innovations for automotive as well as for the Internet of Things (IoT), power management and motor control sectors. Among a total of sixteen live demonstrations there will be several focusing on automotive applications in the areas of ignition IGBTs, ADAS, driver occupancy / in cabin vision and monitoring, and laser front lighting. These will show how the various products and technologies of the new, expanded ON Semiconductor can be utilized and combined to enable energy efficient innovations in integrated systems throughout the vehicle. Packaging and Pricing The FAM65V05DF1 is offered in an APM 27L Double DIP package and priced at $38.50 per unit in 1,000 unit quantities. Read the FAM65V05DF1 blog and visit the website for more detailed product information. Číst dál...
11. ledna 2017 | For the third quarter of 2016, highlights include: • Total revenues of $950.9 million • GAAP gross margin of 34.6 percent and non-GAAP gross margin of 35.9 percent • GAAP operating margin of 4.9 percent, and non-GAAP operating margin of 12.9 percent • Closed acquisition of Fairchild Semiconductor PHOENIX, Ariz. – Nov. 6, 2016 – ON Semiconductor Corporation (Nasdaq: ON) today announced that total revenues in the third quarter of 2016 were $950.9 million, up approximately eight percent compared to the second quarter of 2016. Third quarter revenue includes contribution of approximately $53 million from our acquisition of Fairchild Semiconductor, which closed on September 19, 2016. However, divestiture of the Ignition IGBT, TVS diodes and Thyristor product lines negatively impacted revenue by approximately $5 million for the third quarter. During the third quarter of 2016, the company reported GAAP net income of $10.1 million, or $0.02 per diluted share. Third quarter GAAP income before income taxes was $87.3 million as compared to $33.4 million in the second quarter. Third quarter 2016 non-GAAP income before income taxes was $107.3 million, compared to $96.7 million for the second quarter of 2016. Cash paid for taxes for the third quarter was approximately $6.5 million, as compared to $7.3 million in the second quarter. A reconciliation of these non-GAAP financial measures (and other non-GAAP measures used elsewhere in this release) to the company"s most directly comparable measures prepared in accordance with U.S. GAAP are set forth in the attached schedules and on our website at http://www.onsemi.com. Additional information on revenue by end market, region, distribution channel, business units and share count can be found on the "Investor Relations" section of our website. Third quarter GAAP gross margin was 34.6 percent, and non-GAAP gross margin in the third quarter was 35.9 percent. For the third quarter of 2016, GAAP operating margin was 4.9 percent, and non-GAAP operating margin was 12.9 percent. Adjusted EBITDA for the third quarter of 2016 was $180.2 million. Adjusted EBITDA for the second quarter of 2016 was $161.7 million. "The acquisition of Fairchild positions ON Semiconductor as a highly diversified and broad based supplier of analog and power semiconductors, and marks an inflection point in our quest to become a leader in the analog and power management semiconductor market." said Keith Jackson, president and CEO of ON Semiconductor. "Following the close of the transaction, our assessment of Fairchild fully confirms our strategic and financial rationale for the acquisition, and I am very pleased to report that as of now, we are tracking significantly ahead of our announced synergy targets." "Business conditions remain steady across most end-markets and geographies. Our momentum in key end-markets remains strong and with increased scale and an expanded product portfolio, we are well positioned to drive top-line growth, margin expansion and meaningfully higher free cash flow going forward." FINANCIALS FOURTH QUARTER 2016 OUTLOOK "Based on product booking trends, backlog levels, and estimated turns levels, we anticipate that total ON Semiconductor revenue will be approximately $1,190 to $1,240 million in the fourth quarter of 2016," Jackson said. "Backlog levels for the fourth quarter of 2016 represent approximately 80 to 85 percent of our anticipated fourth quarter 2016 revenue. The outlook for the fourth quarter of 2016 includes stock-based compensation expense of approximately $13 million to $15 million. Net cash paid for income taxes is expected to be $7 million to $11 million." In consideration of new and revised Compliance & Disclosure Interpretations on the use of non-GAAP financial metrics and reporting by U.S. listed companies from the U.S. Securities and Exchange Commission, the company re-evaluated its use of non-GAAP financial information. As a result of that re-evaluation, starting with the third quarter of 2016, the company will limit its forward guidance to the following GAAP financial information: Revenue; Gross Margin; Operating Expenses; Other Income and Expense; Diluted Share Count; and Net Cash Paid for Income Taxes. In addition, the company will limit the non-GAAP financial measures in its forward guidance and subsequent results to non-GAAP Gross Margin, non-GAAP Operating Expenses, and non-GAAP Other Income and Expense. The following table outlines ON Semiconductor"s projected fourth quarter of 2016 GAAP and non-GAAP outlook. ON SEMICONDUCTOR FOURTH QUARTER 2016 BUSINESS OUTLOOK * Convertible Notes, Non-cash Interest Expense is calculated pursuant to FASB"s Accounting Standards Codification (“ASC”) Topic 470: Debt. ** Diluted share count can vary for, among other things, the actual exercise of options or vesting of restricted stock units, the incremental dilutive shares from the company"s convertible senior subordinated notes, and the repurchase or the issuance of stock or convertible notes or the sale of treasury shares. In periods when the quarterly average stock price per share exceeds $18.50, the non-GAAP diluted share count and non-GAAP net income per share includes the anti-dilutive impact of the company’s hedge transactions, issued concurrently with the 1.00% Notes. At an average stock price per share between $18.50 and $25.96, the hedging activity offsets the potentially dilutive effect of the 1.00% Notes and warrants. *** Special items may include: amortization of acquisition-related intangibles; expensing of appraised inventory fair market value step-up; purchased in-process research and development expenses; restructuring, asset impairments and other, net; goodwill impairment charges; gains and losses on debt prepayment; non-cash interest expense; actuarial (gains) losses on pension plans and other pension benefits; and certain other special items, as necessary. These special items could change significantly and are subject to swings from period to period. As a result, we are not able to reasonably estimate and separately present the individual impact of these special items. For this reason, we use a projected range of the aggregate amount of special items in order to calculate our projected non-GAAP operating expense outlook. **** Regulation G and other provisions of the securities laws regulate the use of financial measures that are not prepared in accordance with GAAP. We believe these non-GAAP measures provide important supplemental information to investors. We use these measures, together with GAAP measures, for internal managerial purposes and as a means to evaluate period-to-period comparisons. However, we do not, and you should not, rely on non-GAAP financial measures alone as measures of our performance. We believe that non-GAAP financial measures reflect an additional way of viewing aspects of our operations that - when taken together with GAAP results and the reconciliations to corresponding GAAP financial measures that we also provide in our releases - provide a more complete understanding of factors and trends affecting our business. Because non-GAAP financial measures are not standardized, it may not be possible to compare these financial measures with other companies" non-GAAP financial measures, even if they have similar names. TELECONFERENCE ON Semiconductor will host a conference call for the financial community at 9:00 a.m. Eastern Time (EST) on November 7, 2016, to discuss this announcement and ON Semiconductor’s results for the third quarter of 2016. The company will also provide a real-time audio webcast of the teleconference on the Investor Relations page of its website at http://www.onsemi.com. The webcast replay will be available at this site approximately one hour following the live broadcast and will continue to be available for approximately 30 days following the conference call. Investors and interested parties can also access the conference call through a telephone call by dialing (877) 356-3762 (U.S./Canada) or (262) 558-6155 (International). In order to join this conference call, you will be required to provide the Conference ID Number - which is 1373997. # # # This document contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. All statements, other than statements of historical facts, included or incorporated in this document could be deemed forward-looking statements, particularly statements about the future financial performance of ON Semiconductor. Forward-looking statements are often characterized by the use of words such as “believes,” “estimates,” “expects,” “projects,” “may,” “will,” “intends,” “plans,” or “anticipates,” or by discussions of strategy, plans or intentions. All forward-looking statements in this document are made based on our current expectations, forecasts, estimates and assumptions, and involve risks, uncertainties and other factors that could cause results or events to differ materially from those expressed in the forward-looking statements. Among these factors are our revenues and operating performance; economic conditions and markets (including current financial conditions); effects of exchange rate fluctuations; the cyclical nature of the semiconductor industry; changes in demand for our products, changes in inventories at our customers and distributors, technological and product development risks; enforcement and protection of our IP rights and related risks; risks related to the security of our information systems and secured network; availability of raw materials, electricity, gas, water and other supply chain uncertainties; our ability to effectively shift production to other facilities when required in order to maintain supply continuity for our customers; variable demand and the aggressive pricing environment for semiconductor products; our ability to successfully manufacture in increasing volumes on a cost-effective basis and with acceptable quality for our current products; legislative, regulatory and economic developments; competitor actions, including the adverse impact of competitor product announcements; pricing and gross profit pressures; loss of key customers; order cancellations or reduced bookings; changes in manufacturing yields; control of costs and expenses and realization of cost savings and synergies from restructurings; significant litigation; risks associated with decisions to expend cash reserves for various uses in accordance with our capital allocation policy such as debt prepayment, stock repurchases, or acquisitions rather than to retain such cash for future needs; risks associated with acquisitions and dispositions (including from integrating and consolidating and timely filing financial information with the SEC for acquired businesses and difficulties encountered in accurately predicting the future financial performance of acquired businesses); risks associated with our substantial leverage and restrictive covenants in our debt agreements that may be in place from time to time; risks associated with our worldwide operations, including foreign employment and labor matters associated with unions and collective bargaining arrangements, as well as man-made and/or natural disasters affecting our operations and finances/financials; the threat or occurrence of international armed conflict and terrorist activities both in the United States and internationally; risks and costs associated with increased and new regulation of corporate governance and disclosure standards; risks related to new legal requirements, including laws, rules and regulations related to taxes; risks involving environmental or other governmental regulation; and risks associated with our recent acquisition of Fairchild, including: (1) IP litigation matters relating to Fairchild and litigation challenging the transaction; (2) our ability to retain key personnel; (3) competitive responses to the transaction; (4) unexpected costs, charges or expenses resulting from the transaction; (5) adverse reactions or changes to business relationships resulting from the transaction; (6) our ability to realize the benefits of the acquisition of Fairchild; (7) delays, challenges and expenses associated with integrating the businesses; and (8) our ability to comply with the terms of the indebtedness incurred in connection with the transaction. Additional factors that could affect our future results or events are described under Part I, Item 1A “Risk Factors” in our 2015 Form 10-K, Quarterly Reports on Form 10-Q, and Current Reports on Form 8-K. You should carefully consider the trends, risks and uncertainties described in this document, the 2015 Annual Report on Form 10-K filed with the SEC on February 24, 2016 ("2015 Form 10-K") and other reports filed with or furnished to the SEC before making any investment decision with respect to our securities. If any of these trends, risks or uncertainties actually occurs or continues, our business, financial condition or operating results could be materially adversely affected, the trading prices of our securities could decline, and you could lose all or part of your investment. Readers are cautioned not to place undue reliance on forward-looking statements. We assume no obligation to update such information, except as may be required by law. All forward-looking statements attributable to us or persons acting on our behalf are expressly qualified in their entirety by this cautionary statement. Číst dál...
11. ledna 2017 | Electronica - MUNICH, Germany – Nov. 7, 2016 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has launched new intelligent power module (IPM) technologies for industrial power management and motor control applications. Reinforcing the company’s position as a leading supplier of IPMs, the company’s new STK57FU394AG-E (15A) and STK5MFU3C1A-E (30A) are advanced 600 V IPMs that integrate a power factor correction (PFC) converter, three-phase inverter output stage, pre-drive circuitry and protection in a single, compact package. High levels of integration help to reduce part count and board space compared to discrete designs in applications that include motor control, inverter control and HVAC systems. Microcontroller-compatible low-voltage input and status outputs support further component and space reduction by eliminating the need for photocouplers between a host micro and the IPM. The devices feature built-in cross conduction prevention, which reduces the possibility of system malfunctions caused by noise, and over-current protection for both the inverter and PFC section. Under-voltage lock-out ensures IGBT gate shutdown in the event of abnormal conditions. The devices are certified to UL1557 and offer an externally accessible embedded thermistor for high-precision monitoring of the temperature of the insulated metal substrate. Sungil Yong, director of IPMs for the high power division at ON Semiconductor states: “Our advanced packaging and integration capabilities allow ON Semiconductor to deliver high-performance, efficient and compact power devices that address industry requirements to reduce BoMs and drive PCB real estate requirements. The STK57FU394AG-E and STK5MFU3C1A-E deliver the power density, functionality and reliability demanded by next-generation inverter-based systems.” At Electronica 2016, the company’s 400 square meter booth will feature a variety of technologies and demonstrations covering power management and motor control, including an 800 W motor driver system solution featuring the STK5Q4U3xxJ compact IPM and NCP1631 interleaved PFC controller. The solution also utilizes ON Semiconductor’s NCP1063 AC/DC regulator for the auxiliary power supply and sensing using NCS20034 quad op-amps. The NIS5020 and NIS5132 eFuse devices will be also be on display, demonstrating advantages over conventional PTC and other surge protection and inrush limiting technologies offering features such as 10 µs fault response time, over voltage clamp, thermal shutdown & adjustable current limit. In addition, in a classic double pulse test setup, the best-in-class performance of the NGTB40N120FL3 1200V/40Amp IGBT, accompanied by the FFSH40120ADN 1200V/40Amp SiC diode will be demonstrated. Visitors to the ON Semiconductor booth will also have the opportunity to see smart passive sensor and DC/DC point of load demonstrations, test the ON Semiconductor online design and simulation tools, and view new innovations in automotive applications and solutions for the IoT. Packaging and Pricing The STK57FU394AG-E is offered in a 56 mm x 25.8 mm SIP2A package and priced at $7.40 per unit in 10,000 unit quantities. The STK5MFU3C1A-E is offered in a 70 mm x 30.1 mm SIP3B package and priced at $12.30 per unit in 10,000 unit quantities. The new IPMs are available today and two evaluation boards can also be ordered, the STK57FU394AGGEVB and STK5MFU3C1AGEVB, which are recommended for designers who want to evaluate the devices in detail. Visit the website for more detailed product information about ON Semiconductor’s IPM solutions. Číst dál...
11. ledna 2017 | STK57FU394AG-E STK5MFU3C1A-E : 2-in-1 PFC and Inverter Intelligent Power Module (IPM), 600 V, 15 A or 30 AInternal bootstrap circuit enables single control power supply for high side pre-driverOver current protection for inverter and PFC terminalsExternally accessible embedded thermistor for substrate temperature measurement Číst dál...
10. ledna 2017 | SHENZHEN, China –Jan.9, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, today announced that it has been honored with two prestigious partnership awards from the world’s largest telecommunications equipment manufacturer, Huawei Technologies Co., Ltd, and its subsidiary of Consumer Business Group, Huawei Device Co., Ltd. Číst dál...
10. ledna 2017 | PHOENIX, Ariz. - Jan9, 2017 - ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has announced a collaboration with Hexius Semiconductor to qualify several of their analog intellectual property (IP) blocks in its popular ONC18 0.18 µm CMOS process.This enables ON Semiconductor to better serve its customers with proven analog IP that can ultimately reduce design cycles and time-to-market. The eight initial designs resulting from this collaboration include a variety of analog-to-digital converters, digital-to-analog converters, voltage references and current references. There is provision, if needed, for the designs to be custom-tailored to match particular application demands. Further data converter and PLL designs are currently being developed for introduction later this year. ON Semiconductor’s ONC18 process relies on a 0.18 micrometer (µm) CMOS architecture and due to its high voltage capabilities is extremely well suited to automotive, industrial, military and medical deployment. By having access to an expansive portfolio of qualified IP that supports this process, customers will be able to benefit from ASIC implementations that are highly optimized for their specific requirements, without needing to allocate too much of their own engineering resources to the task. As a result, much quicker design cycles, reduced risk of re-spins and lower associated costs can all be realized. “The mixed signal ASIC market continues to grow as systems need to utilize the real-word data that is captured by sensors and user interface,” states Rocke Acree, Director of the Custom Foundry business unit at ON Semiconductor. “OEMs are looking to integrate more effective proprietary designs, rather than relying on standard off-the-shelf components. Through this, performance levels can be enhanced, board space saved and unit costs significantly lowered. By working together, ON Semiconductor and Hexius Semiconductor are delivering qualified analog IP needed to facilitate this migration and enabling a new era of mixed signal design.” “Through the combination of the respective skill sets that our two companies possess, we are in a position to supply the industry with qualified analog IP macrocells on superior semiconductor processes that will deliver clear performance and logistical advantages. This will allow OEMs to respond more quickly to market opportunities that they have identified by taking products from the concept phase right through to full commercial production in the shortest possible time,” adds Chris Cavanagh, CEO at Hexius Semiconductor. Visit our External Intellectual Property page for more information. Číst dál...
05. ledna 2017 | NSVF4009SG4 : RF Transistor for Low Noise Amplifier ApplicationsLow-noise performance of 1.1 dB enables clear signal amplificationHigh cut-off frequency of 25 GHz for use in high frequency applicationsHigh gain of 17 dB enables reception of small signals Číst dál...
05. ledna 2017 | NCP1340 NCP1341 : High-Voltage, Quasi-Resonant Controller Featuring Valley Lock-Out SwitchingQR frequency jittering reduces EMI signatureMaximize efficiency with valley switching and lockoutQuiet-Skip™ technology enables operation outside audible range Číst dál...
03. ledna 2017 | PHOENIX, AZ – Nov. 1, 2016 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, is bringing the advanced global shutter imaging performance of the PYTHON CMOS image sensor family to a cost-effective, small-footprint design. Číst dál...
03. ledna 2017 | PHOENIX, Ariz. – October 24, 2016 – ON Semiconductor Corporation (Nasdaq: ON) plans to announce its financial results for the third quarter, which ended September 30, 2016, before the market opens on Monday, November 7, 2016. The company will host a conference call at 9 a.m. Eastern Time (EST) on November 7, 2016, following the release of its financial results. Investors and interested parties can access the conference call in the following manner: Webcast: A live webcast of the conference call will be available via the “Investor Relations” section of the company’s website at http://www.onsemi.com. The re-broadcast of the call will be available at this site approximately one hour following the live broadcast and will remain available for 30 days. Teleconference: A telephone conference of the earnings report can be accessed by dialing (877) 356-3762 (U.S./Canada) or (262) 558-6155 (International). In order to join this conference call, you will be required to provide the Conference ID Number – which is 1373997. Číst dál...
03. ledna 2017 | PhotoPlus New York, New York – Oct. 20, 2016 – ON Semiconductor (Nasdaq: ON), driving energy efficiency innovations, has drawn on its extensive expertise in image sensor technology to help support Silicon Valley start-up Light. The company has provided Light with key imaging hardware for its game-changing L16 camera solution, which utilizes advanced computational processing to set new performance benchmarks. Číst dál...
03. ledna 2017 | PHOENIX, AZ – October 18, 2016 – ON Semiconductor (Nasdaq: ON ), driving energy efficient innovations, has introduced a highly integrated single chip power bank solution for the development of next generation Li-Ion powered products. The LC709501F total Li-Ion battery solution offers broad power and voltage/current output range of 5 volt (V), 9 V and 12 V operation, with a maximum charge/discharge capability of up to 30 watts (W) through simple FET selection. Číst dál...
03. ledna 2017 | NB7VPQ701M : 1.8 V USB 3.1 Single Channel Re-driverSupports USB 3.1 Gen 1 and USB 3.1 Gen 2 data rates of 5 Gbps and 10 GbpsUser selectable equalization, de-emphasis and output swing to compensate for inter symbol interference lossesEnable pin for deep power saving mode Číst dál...
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